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| Classification |
Name of divisions and companies |
Date of registration |
Scope of registration |
Yoshikawa Kogyo Co., Ltd. |
High Precision Center (Kimitsu Plant, Kitakyushu Plant) |
Nov. 2000 |
Design, development and manufacture of pressed precision metal parts for electronic devices(Kimitsu Plant)
Manufacture of plastic package for housing electronic parts (Kitakyushu Plant) |
| Surface Treatment Division |
Apr. 2005 |
Design, development, manufacture and servicing of cylinder jacket for printing machine |
Affiliated companies |
PT Yoshikawa Electronics Bintan |
Mar. 1999 |
Manufacture and testing of semiconductor integrated circuit |
Yoshikawa Seimitsu Co., Ltd. |
Apr. 2004 |
Design, development and manufacture of die and manufacture of parts and pressed products (Contract-out item: 7.5.2 Validation of process relating to manufacture and service delivery) |
| Yoshikawa Semiconductor Co., Ltd. |
Nov. 1994 |
Design and manufacture of semiconductor integrated circuit and semiconductor integrated module
Affiliated business place
Yoshikawa Electronics Engineering Co., Ltd. ---Technology and quality assurance
Semiconductor Sales Dept., Yoshikawa Kogyo Co., Ltd.--- Sales and marketing
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| Yoshikawa Hightech (Shenzhen) Co., Ltd. |
Dec. 2006 |
Manufacture of metal parts for precision motor.
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| Classification |
Name of divisions and companies |
Date of registration |
Scope of registration |
Yoshikawa Kogyo Co., Ltd. |
High Precision Center (Kimitsu Plant, Kitakyushu Plant) |
Apr. 2003 |
Design, development and manufacture of pressed precision metal parts for electronic devices (Kimitsu Plant) Manufacture of plastic package for housing electronic parts (Kitakyushu Plant) |
| Surface Treatment Division |
Jan. 2005 |
Business activities concerning surface treatment using thermal spay and its related technology |
Affiliated companies |
Yoshikawa Semiconductor Co., Ltd. |
Dec. 1998 |
Manufacture of semiconductor integrated circuit and semiconductor integrated module |
| PT Yoshikawa Electronics Bintan |
Apr. 2001 |
Manufacture and testing of semiconductor integrated circuit |
| West-Japan Auto Recycle Co., Ltd. |
Jan. 2003 |
Business activities concerning dismantling and recycling of car, recovery and sales of reconditioned parts and recovery of nonferrous metal |
| Yoshikawa Seimitsu Co., Ltd. |
Apr. 2004 |
Business activities concerning manufacture of die, parts and pressed products |
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