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We are supplying Au/Sn-plated sealing lid used widely for SAW devices based on our original process, realizing stable sealing effect at low cost. In conventional processes, Au/Sn foil (40 m) is pressed into ring form and stuck to a pressed lid (Au flash plated) by reflow soldering. In this process, initial cost is high and, in addition, there has been a problem that control of Au/Sn thickness is difficult and, as a result, product quality is liable to be unstable.To solve the above problem, we have developed a lid having Au/Sn plated layers; produced through the following processes. We succeeded in producing a material that works as an alloy, by plating Au-Sn-Au-Sn-Au layers directly on a material plate (made by flash plating of Au) and diffusing the plated layers by aging. Furthermore, by pressing the plated material in accordance with required size, uniform Au/Sn thickness can be secured. As for sizes, we can respond from single lid for one package to sheet lid for PCB in sheet. |
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| Au and Sn plated layer Au:Sn (8:2) Thickness and size are optional. |
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| Aging + overall Au flash plating | ||||||||||||||
| By aging, Au and Sn are diffused. |  |
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Kimitsu Works, Yoshikawa High Precision, Yoshikawa Kogyo Co. Ltd Phone +81-439-52-6473
Fax +81-439-52-6466 |
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